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Chips ready now, and one made for you.

The same inference cores and three routes can cast any model into silicon. Pick a chip that fits, or have one made for your model.

Three chips side by side
Fig. 1 · First-generation production ASICs
Forge lightweight edge LLM inference chip in a QFN package

Forge

Lightweight edge chip

A complete language model inside a sub-watt handheld device.

17,000 token/s

Trident flagship LLM inference chip, BGA package with metal lid

Trident

Flagship heavy-load chip

Run a 35B model locally at 15,000 token/s with a 70 W system budget.

15,000 token/s

Argus multimodal vision inference chip next to a camera module

Argus

Multimodal vision chip

Pixel-level real-time vision inference at 120 FPS.

120 FPS

Die surface with memory arrays and logic regions (illustrative)

Custom ASIC

Made for your model

Your model, your chip. The same cores and routes, redefined around your model, power budget and volume.

0.6B → 35B+ model range

Figures on this page are current product definitions and design targets. Final specifications, test conditions, availability and delivery versions are confirmed per project.

From an email to a chip

  1. 01

    Choose the route

    Target model, performance and power goals, update cadence, interfaces. The first question is always: how often does the model change?

  2. 02

    FPGA evaluation

    Deploy the inference core on the evaluation board, run the model, measure accuracy and throughput: the first engineering sample.

  3. 03

    System design-in

    Interfaces, system software and field validation around the evaluation results, turning the sample into a product prototype.

  4. 04

    ASIC delivery

    Once the model is frozen: production ASIC, or the IP integrated into your own silicon.

Request an engineering sample

Send the target model, performance goal, power budget and interfaces. We confirm the route and reply with a sample plan.

Request a sample